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DS176

DS176首页预览图
型号: DS176
PDF文件:
  • DS176 PDF文件
  • DS176 PDF在线浏览
功能描述: Zynq-7000 AP SoC and 7 Series Devices Memory Interface Solutions (v4.1)
PDF文件大小: 331.54 Kbytes
PDF页数: 共13页
制造商: XILINX[Xilinx, Inc]
制造商LOGO: XILINX[Xilinx, Inc] LOGO
制造商网址: http://www.xilinx.com
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PDF页面索引
120%
DS176 October 5, 2016 www.xilinx.com
Advance Product Specification 1
Introduction
The Xilinx
®
Zynq
®
-7000 All Programmable SoC and
7 series FPGAs memory interface solutions cores provide
high-performance connections to DDR3 and DDR2
SDRAMs, QDR II+ SRAM, RLDRAM II/RLDRAM 3, and
LPDDR2 SDRAM.
DDR3 and DDR2 SDRAMs
This section discusses the features, applications, and
functional description of Xilinx 7 series FPGAs memory
interface solutions in DDR3 and DDR2 SDRAMs. These
solutions are available with an optional AXI4 slave
interface.
DDR3 SDRAM Features
Component support for interface widths up to 72 bits
Single and dual rank UDIMM, RDIMM, and SODIMM
support
DDR3 (1.5V) and DDR3L (1.35V)
1, 2, 4, and 8 Gb density device support
8-bank support
x8 and x16 device support
8:1 DQ:DQS ratio support
Configurable data bus widths (multiples of 8, up to
72 bits)
8-word burst support
Support for 5 to 14 cycles of column-address strobe
(CAS) latency (CL)
On-die termination (ODT) support
Support for 5 to 10 cycles of CAS write latency
ZQ calibration – initial and periodic (configurable)
Write leveling support for DDR3 (fly-by routing
topology required for DDR3 component designs)
JEDEC
®
-compliant DDR3 initialization support
Source code delivery in Verilog and VHDL (top-level
files only)
4:1 and 2:1 memory to FPGA logic interface clock ratio
ECC support
I/O Power Reduction option reduces average I/O
power by automatically disabling DQ/DQS IBUFs and
internal terminations during writes and periods of
inactivity
Internal V
REF
support
Multicontroller support for up to eight controllers
Two controller request processing modes:
o Normal: reorder requests to optimize system
throughput and latency
o Strict: memory requests are processed in the order
received
Zynq-7000 AP SoC and 7 Series Devices
Memory Interface Solutions (v4.1)
DS176 October 5, 2016 Advance Product Specification
LogiCORE™ IP Facts Table
Core Specifics
Supported
Device Family
(1)
Zynq
®
-7000 All Programmable SoC,
Virtex
®
-7
(2)
, Kintex
®
-7
(2)
, Artix
®
-7
Supported
Memory
DDR3 Component and DIMM, DDR2
Component and DIMM, QDR II+, RLDRAM II,
RLDRAM 3, and LPDDR2 SDRAM Components
Resources See Table 1.
Provided with Core
Documentation Product Specification
User Guide
Design Files Verilog, VHDL (top-level files only)
Example Design Verilog, VHDL (top-level files only)
Test Bench Not Provided
Constraints File XDC
Supported
S/W Driver
N/A
Tested Design Flows
(3)
Design Entry
Vivado
®
Design Suite
Simulation For supported simulators, see t he
Xilinx Design Tools: Rele ase Notes G uide
.
Synthesis
(4)
Vivado Synthesis
Support
Provided by Xilinx at the Xilinx Support web page.
Notes:
1. For a complete listing of supported devices, see the release notes for
MIG.
2. See the Virtex-7 FPGAs Data Sheet: DC and Switching Characteristics
or the Kintex-7 FPGAs Data Sheet: DC and Switching Characteristics for
performance information.
3. For the supported versions of the tools, see the
Xilinx Design Tools: Release Notes Guide
.
4. The standard synthesis flow for Synplify is not supported for the
core.
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