Issue 1 - September 2005 1 www.zetex.com
© Zetex Semiconductors plc 2005
Package information - DIL8
Dual in-line, 8 pin package
Package outline
Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters
Taping specification
Dual inline devices (DIL8, DIL14, DIL16 and DIL20) are provided in tubes.
DIM Inches Millimeters DIM Inches Millimeters
Min Max Min Max Min Max Min Max
A - 0.210 - 5.33 D1 0.005 - 0.13 -
A1 0.015 - 0.38 - E 0.300 0.325 7.62 8.26
A2 0.115 0.195 2.92 4.95 E1 0.240 0.280 6.10 7.11
b 0.014 0.022 0.36 0.56 e 0.100 BSC 2.54 BSC
b2 0.045 0.070 1.14 1.78 eA 0.300 BSC 7.62 BSC
b3 0.030 0.045 0.76 1.14 eB - 0.430 - 10.92
c 0.008 0.014 0.20 0.36 eC 0.000 0.060 0.00 1.52
D 0.355 0.400 9.02 10.16 L 0.115 0.150 2.92 3.81
E1
D
A2
A
L
A1
e
b
b2
E
b3
D1
b2
eA
eB
c
eC
