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CSPRC032AG

CSPRC032AG首页预览图
型号: CSPRC032AG
PDF文件:
  • CSPRC032AG PDF文件
  • CSPRC032AG PDF在线浏览
功能描述: 4 Channel EMI Filter Network
PDF文件大小: 224.75 Kbytes
PDF页数: 共5页
制造商: CALMIRCO[California Micro Devices Corp]
制造商LOGO: CALMIRCO[California Micro Devices Corp] LOGO
制造商网址: http://www.calmicro.com
捡单宝CSPRC032AG
供应商
型号
品牌
封装
批号
库存数量
备注
询价
  • 集好芯城

    16

    0755-8328588218188616606陈妍深圳市福田区深南中路3023号汉国中心55楼11010804

  • CSPRC032AG
  • CMD 
  • BGA-9 
  • 最新批? 
  • 14601 
  • 原厂原装现货匹配 

  • 深圳市百视威讯电子科技有限公司

    8

    0755-2738127418098996457董先生华强广场C座18J11011910

  • CSPRC032AG
  • 一级代理 
  • 一级代理 
  • 一级代理 
  • 36000 
  • 一级代理放心采购 

  • 深圳市大源实业科技有限公司

    7

    0755-8486207015302619915,13762584085李小姐深圳市龙岗区坂田街道山海商业广场C座70711012571

  • CSPRC032AG
  • CMD 
  • CSP-9 
  • 22+ 
  • 3660 
  • 公司原装现货,量大可定 

PDF页面索引
120%
© 2005 California Micro Devices Corp. All rights reserved.
11/09/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 1
CSPRC032A
4 Channel EMI Filter Network
Features
4 EMI filter lines per device
Filters attenuate to –30dB at 3GHz
CSP package minimizes cross-talk
9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
0.30mm Eutectic solder bumps
Ultra small footprint suitable for portable devices
Lead-free version available
Applications
EMI filtering for RF sections of wireless devices
Cellular phones
Cordless phones
Internet appliances
•PDAs
Laptop computers
Product Description
The CSPRC032A is a 4-channel low pass EMI filter (R-
C-R configuration) in a Chip Scale Package (CSP).
Many portable applications require the attenuation of
signals in the 800-3000 MHz band. California Micro
Devices’ unique thin film technology provides a mini-
mum of –25dB of attenuation over this frequency band.
The bump size and pitch of these filters are selected
such that the device can be placed directly on an FR4
printed circuit board using conventional assembly tech-
niques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/
Ag/Cu for lead-free finish) and are 0.30 mm in diame-
ter.
The CSPRC032A is available in a space-saving, low-
profile Chip Scale Package with optional lead-free fin-
ishing.
Electrical Schematic
R
50
C
43pF
50
R
B1A1
GND
R
50
C
43pF
50
R
B2A2
GND
R
50
C
43pF
50
R
B4A4
GND
R
50
C
43pF
50
R
B5A5
GND
B3
GND
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