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CSG48

CSG48首页预览图
型号: CSG48
PDF文件:
  • CSG48 PDF文件
  • CSG48 PDF在线浏览
功能描述: 100% Material Declaration
PDF文件大小: 92.11 Kbytes
PDF页数: 共2页
制造商: XILINX[Xilinx, Inc]
制造商LOGO: XILINX[Xilinx, Inc] LOGO
制造商网址: http://www.xilinx.com
捡单宝CSG48
PDF页面索引
120%
100% Material Declaration
Data Sheet
CSG48
PK102 (v1.3) September 28, 2006 Material Declaration Data Sheet
Average Weight: 0.2 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.00562 2.81%
Silicon 7440-21-3 100.00 0.00562
Die Attach
Material
0.00118 0.59%
Resin (EP) Trade Secret 22.00 0.0002596
Silver 7440-22-4 78.00 0.009204
Encapsulant
0.0947 47.35%
Epoxy Resins Trade Secret 6.00 0.005682
Phenolic Resins Trade Secret 6.00 0.005682
Carbon Black 1333-86-4 0.50 0.0004735
Silica 60676-86-0 84.00 0.079548
Bismuth 7440-69-9 Max 1.00 0.000947
Metal Hydroxide Trade Secret 2.50 0.0023675
Laminate
0.0301 15.05%
Bismaleimide/Triazine
Board
13676-54-5 /
25722-66-1
72.685 0.021878185
Copper 7440-50-8 9.880 0.00297388
Nickel 7440-02-0 7.270 0.00218827
Gold 7440-57-5 1.160 0.00034916
Antimony Pentoxide 1314-60-9 0.005 Flame Retardant 0.000001505
Brominated Resin 68541-56-0 9.000 Flame Retardant 0.002709
Bond Wire
0.00036 0.18%
Gold 7440-57-5 100.00 0.00036
Solder Balls
0.06804 34.02%
Tin 7440-31-5 95.50 0.0649782
Silver 7440-22-4 4.00 0.0027216
Copper 7440-50-8 0.50 0.0003402
PK102 (v1.3) September 28, 2006 www.xilinx.com 1
© 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
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