100% Material Declaration
Data Sheet
CS48
PK148 (v1.2) September 28, 2006 Material Declaration Data Sheet
Average Weight: 0.2 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.00562 2.81%
Silicon 7440-21-3 100.00 0.00562
Die Attach
Material
0.0018 0.59%
Silver 7440-22-4 78.00 0.001404
Resin (EP) Trade Secret 22.00 0.000396
Encapsulant
0.0947 47.35%
Epoxy Resins Trade Secret 6.00 0.005682
Phenolic Resins Trade Secret 6.00 0.005682
Carbon Black 1333-86-4 0.50 0.0004735
SiO2 Filler 60676-86-0 84.00 0.079548
Bismuth 7440-69-9 Max 1.00 0.000947
Metal Hydroxide Trade Secret 2.50 0.0023675
Laminate
0.0301 15.05%
Bismaleimide/Triazin
e Board
13676-54-5 /
25722-66-1
72.685 0.021878185
Copper 7440-50-8 9.880 0.00297388
Nickel 7440-02-0 7.270 0.00218827
Gold 7440-57-5 1.160 0.00034916
Antimony Pentoxide 1314-60-9 0.005 0.000001505
Brominated Resin 68541-56-0 9.000 0.002709
Bond Wire
0.00036 0.18%
Gold 7440-57-5 100.00 0.00036
Solder Balls
0.06804 34.02%
Tin 7440-31-5 63.00 0.0428652
Lead 7439-92-1 37.00 0.0251748
PK148 (v1.2) September 28, 2006 www.xilinx.com 1
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