PK480 (v1.0) June 17, 2011
100% Material Declaration Data Sheet CS324
Average Weight: 0.545 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.009997 1.834
Silicon 7440-21-3 100.00 Main material 0.009997
Die Attach
Material
0.007051 1.294
Silver 7440-22-4 77.50 Main material 0.005465
Bismaleimide
monomer
Trade Secret
15.00 Main material 0.001058
Acrylate monomer Trade Secret 7.50 Main material 0.000529
Gold Wire
0.006702 1.230
Gold 7440-57-5 99.05 Main material 0.006638
Palladium 7440-05-3 0.95 Dopant 0.000064
Mold
Compound
0.216990 39.815
Solid Epoxy Resin Trade Secret 5.00 Main material 0.010850
Phenol Resin Trade Secret 5.00 Main material 0.010850
Fused Silica 60676-86-0 84.45 Filler 0.183248
Metal Hydroxide Trade Secret 5.00 Flame retardant 0.010850
Carbon Black 1333-86-4 0.55 Color agent 0.001193
Solder Balls
0.096708 17.745
Tin (Sn) 7440-31-5 63.00 Main material 0.060926
Lead (Pb) 7439-92-1 37.00 Main material 0.035782
Substrate
0.207552 38.083
Copper (Cu) 7440-50-8 13.309 Main material
0.027623
Nickel (Ni) 7440-02-0 4.696 Main material
0.009747
Gold (Au) 7440-57-5 5.606 Main material
0.011635
Glass fiber 65997-17-3 19.884 Glass fiber
0.041270
Non-Halogen Fire
retardant
NA
0.082 Flame retardant
0.000170
BT (core) NA 43.154 Core
0.089567
Solder mask NA 13.269 Solder mask
0.027540
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included h0.erein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK480 (v1.0) June 17, 2011 www.xilinx.com
1
