TDK MLCC US Catalog Version B11Page 71
Appendix - 1a
P.C. Board for reliability test
Applied for C0603, C1005, C1608, C2012, C3216
Appendix - 1b
P.C. Board for reliability test
Applied for C3225, C4532, C5750
Appendix - 2a
P.C. Board for bending test
Applied for C0603, C1005
Appendix - 2b
P.C. Board for bending test
Applied for C1608, C2012, C3216, C3225, C4532, C5750
100 mm
Solder Resist Copper
b
a
c
40 mm
Copper
Solder Resist
Slit
40 mm
100 mm
c
b
a
Solder Resist
Copper
b
a
1.0 mm
c
40 mm
100 mm
1.0 mm
c
a
b
Solder resist
b
100 mm
Copper
40 mm
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: Appendix-2a 0.8mm
Appendix-1a, 1b, 2b 1.6mm
Copper (thickness 0.035mm)
Solder resist
Case Code Dimensions (mm)
JIS EIA a b c
C0603 CC0201 0.3 0.8 0.3
C1005 CC0402 0.4 1.5 0.5
C1608 CC0603 1.0 3.0 1.2
C2012 CC0805 1.2 4.0 1.65
C3216 CC1206 2.2 5.0 2.0
C3225 CC1210 2.2 5.0 2.9
C4532 CC1812 3.5 7.0 3.7
C5750 CC2220 4.5 8.0 5.6
General
Specifications
C Series – General Application