100% Material Declaration
Data Sheet
BGG432
PK198 (v1.0.1) January 8, 2007 Material Declaration Data Sheet
Average Weight: 8.7852 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.0585 0.67%
Silicon 7440-21-3 100.00 0.0585
Die Attach
Material
0.007 0.07%
Resin Trade Secret 25.00 0.002
Silver 7440-22-4 75.00 0.005
Mold
Compound
0.3009 3.42%
Resin Trade Secret 26.00 0.078
Silica 60676-86-0 74.00 0.233
Dam
0.0098 0.11%
Proprietary Trade Secret 27.00 0.002646
Silica 60676-86-0 73.00 0.007154
Laminate
0.8377 9.54%
Copper 7440-50-8 15.51 Metal Layer 0.130
Nickel 7440-02-0 0.95 Metal Layer 0.008
Gold 7440-57-5 0.22 Metal Layer 0.002
Board Trade Secret 61.24 0.513
Solder Mask (EP) Trade Secret 22.08 0.185
Heat Sink
6.8302 77.75%
Copper 7440-50-8 100.00 6.8302
Heat Sink
Plating
0.2920 3.32%
Nickel 7440-02-0 100.00 0.2920
Gold Wire
0.0191 0.22%
Gold 7440-57-5 100.00 0.0191
Solder Balls
0.430 4.90%
Tin 7440-31-5 95.50 0.411
Silver 7440-22-4 4.00 0.017
Copper 7440-50-8 0.50 0.002
PK198 (v1.0.1) January 8, 2007 www.xilinx.com 1
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