PK399 (v1.0) December 7, 2009 www.xilinx.com 1
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Average Weight: 3.9000g
PK399 (v1.0) December 7, 2009
100% Material Declaration Data Sheet BG575
Component
Substance
Description
CAS Number
or
Description
Percentage of
Component
Use in
Product
Component
Weight/
Substance Weight
(Grams)
Component
Percent of Total
Silicon Die 0.08304 2.129%
Silicon 7440-21-3 100.00 0.08304
Die Attach
Material
0.012939 0.332%
Polymetric material Proprietary 3.00 0.000388
Di-Ester resin Proprietary 7.50 0.000970
Functionalized
ester
Proprietary 3.00 0.000388
Silver 7440-22-4 86.50 0.011192
Mold Compound 1.79122 45.929%
Solid epoxy resin Trade secret 5.00 0.089561
Phenol resin Trade secret 5.00 0.089561
Fused silica 60676-86-0 83.00 1.486711
Metal hydro oxide Trade secret 1.00 0.017912
Carbon black 1333-86-4 1.00 0.017912
Crystalline silica 14808-60-7 5.00 0.89561
Substrate 0.883503 22.654%
Copper 7440-50-8 46.27 Metal layer 0.408797
Nickel 7440-02-0 0.60 Metal layer 0.005301
Gold 7440-57-5 0.13 Metal layer 0.001149
Glass fiber (GF) N/A 23.00 0.203206
Flame retardant N/A 3.20 0.028272
BT (core)
HL-832NX
N/A 16.80 0.148429
Solder mask (EP) N/A 10.00 0.088350
Gold Wire 0.019700 0.505%
Gold 7440-57-5 99.05 0.019512
Palladium 7440-05-3 0.95 0.000187
Beryllium 7440-41-7 0.00 Trace 0.0000003
Calcium 7440-70-2 0.00 Trace 0.0000004
Solder Balls 1.109600 28.451%
Tin 7440-31-5 63.00 0.699048
Lead 2425-79-8 37.00 0.410552
