100% Material Declaration
Data Sheet
BG225
PK143 (v1.2.1) January 8, 2007 Material Declaration Data Sheet
Average Weight: 2.599 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.0735 2.83%
Silicon 7440-21-3 100.00 0.0735
Die Attach
Material
0.0073 0.28%
Resin Trade Secret 22.00 0.0016
Silver 7440-22-4 78.00 0.0057
Mold
Compound
1.0846 41.73%
Resin Trade Secret 12.00 0.1302
Silica 60676-86-0 88.00 Filler 0.9544
Laminate
1.1403 43.87%
Laminate Trade Secret Metal Layer 0.5613
Solder Mask (EP) Trade Secret 0.0878
Copper 7440-50-8 Metal Layer 0.4662
Nickel 7440-02-0 Metal Layer 0.0209
Gold 7440-57-5 Metal Layer 0.0041
Gold Wire
0.0117 0.45%
Gold 7440-57-5 100.00 0.0118
Solder Balls
0.2816 10.83%
Tin 7440-31-5 63.00 0.1774
Lead 7439-92-1 37.00 0.1042
PK143 (v1.2.1) January 8, 2007 www.xilinx.com 1
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