AUIRLR3705Z
V
DSS
55V
R
DS(on)
max.
8.0m
I
D (Silicon Limited)
89A
I
D (Package Limited)
42A
Features
Advanced Process Technology
Logic-Level
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175°C junction operating temperature,
fast switching speed and improved repetitive avalanche rating .
These features combine to make this design an extremely efficient
and reliable device for use in Automotive applications and a wide
variety of other applications.
1 2015-12-14
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
AUTOMOTIVE GRADE
Symbol Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited) 89
A
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited) 63
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Package Limited) 42
I
DM
Pulsed Drain Current 360
P
D
@T
C
= 25°C Maximum Power Dissipation 130 W
Linear Derating Factor 0.88 W/°C
V
GS
Gate-to-Source Voltage ± 16 V
E
AS
Single Pulse Avalanche Energy (Thermally Limited) 110
mJ
E
AS
(Tested)
Single Pulse Avalanche Energy Tested Value 190
I
AR
Avalanche Current See Fig.15,16, 12a, 12b A
E
AR
Repetitive Avalanche Energy
mJ
T
J
Operating Junction and -55 to + 175
°C
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case) 300
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Thermal Resistance
Symbol Parameter Typ. Max. Units
R
JC
Junction-to-Case ––– 1.14
°C/W
R
JA
Junction-to-Ambient ( PCB Mount) ––– 50
R
JA
Junction-to-Ambient ––– 110
D-Pak
AUIRLR3705Z
Base part number Package Type
Standard Pack
Orderable Part Number
Form Quantity
AUIRLR3705Z D-Pak
Tube 75 AUIRLR3705Z
Tape and Reel Left 3000 AUIRLR3705ZTRL
G D S
Gate Drain Source
S
G
D
HEXFET
®
Power MOSFET
