AUIRF7759L2TR
Base Part Number Package Type
Standard Pack
Form Quantity
AUIRF7759L2
DirectFET Large Can
Tape and Reel 4000
AUIRF7759L2TR
Orderable Part Number
AUTOMOTIVE GRADE
V
(BR)DSS
75V
R
DS(on)
typ.
1.8m
I
D (Silicon Limited)
160A
max.
2.3m
Q
g (typical)
200nC
DirectFET
®
ISOMETRIC
L8
Automotive DirectFET
®
Power MOSFET
Applicable DirectFET
®
Outline and Substrate Outline
SB SC M2 M4 L4 L6 L8
Description
The AUIRF7759L2TR(1) combines the latest Automotive HEXFET
®
Power MOSFET Silicon technology with the advanced DirectFET
®
packaging to
achieve the lowest on-state resistance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile. The DirectFET
®
package is
compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET
®
package allows dual
sided cooling to maximize thermal transfer in automotive power systems.
This HEXFET
®
Power MOSFET is designed for applications where efficiency and power density are essential. The advanced DirectFET
®
packaging
platform coupled with the latest silicon technology allows the AUIRF7759L2TR(1) to offer substantial system level savings and performance
improvement specifically in motor drive, high frequency DC-DC and other heavy load applications on ICE, HEV and EV platforms. This MOSFET
utilizes the latest processing techniques to achieve low on-resistance and low Qg per silicon area. Additional features of this MOSFET are 175°C
operating junction temperature and high repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and
reliable device for high current automotive applications.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter Max. Units
V
DS
Drain-to-Source Voltage 75
V
V
GS
Gate-to-Source Voltage ±20
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited) 160
A
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited) 113
I
D
@ T
A
= 25°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited) 26
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Package Limited) 375
I
DM
Pulsed Drain Current 640
P
D
@T
C
= 25°C Power Dissipation 125
W
P
D
@T
C
= 100°C Power Dissipation 63
P
D
@T
A
= 25°C Power Dissipation 3.3
E
AS
Single Pulse Avalanche Energy (Thermally Limited) 257 mJ
I
AR
Avalanche Current
See Fig. 16, 17, 18a, 18b
A
E
AR
Repetitive Avalanche Energy
mJ
T
P
Peak Soldering Temperature 270
°C
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
1 2015-10-5
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
Advanced Process Technology
Optimized for Automotive Motor Drive, DC-DC and
other Heavy Load Applications
Exceptionally Small Footprint and Low Profile
High Power Density
Low Parasitic Parameters
Dual Sided Cooling
175°C Operating Temperature
Repetitive Avalanche Capability for Robustness and Reliability
Lead free, RoHS and Halogen free
Automotive Qualified *
D D
S
S
SS
S
S
S
S
G
