AN‐000088
I
2
S
OutputMEMSMicrophoneFlexEvaluationBoard
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSenseInc.
1745TechnologyDrive,SanJose,CA95110U.S.A
+1(408)988–7339
www.invensense.com
DocumentNumber:AN‐000088
Revision:1.0
ReleaseDate:04/26/2016
GENERALDESCRIPTION
ThisuserguideappliestothefollowingMEMSmicrophone
evaluationboards:
EV_ICS‐43434‐FX
Thisisasimpleboardthatallowsquickevaluationofthe
performanceoftheICS‐43434MEMSmicrophone.Thesmall
sizeandlowprofileoftheflexiblePCBenablesdirect
placementofthemicrophoneintoa
prototypeoranexisting
designforaninsituevaluation.TheboardconsistsofanI
2
S‐
outputmicrophonesolderedtoaflexiblePCB.Theonlyother
componentontheboardisa0.1μFsupplybypasscapacitor.
TheflexPCBdesignmatestoa6‐positionZIFconnectorwith
0.5mmpinspacing,suchastheMolex0527450697
connector.TheflexPCBmatestotheconnector
byfirst
pullingouttheconnector’sclamp,insertingtheflexPCB,and
thenpushingtheclampclosed.Wirescanbesoldereddirectly
tothisconnector’spinsoritcanbemounteddirectlyona
rigidPCBforevaluation.Werecommendtouse28AWGor
smallerwireforsolderingto
thisconnector’spins.ThePCB
thicknessatthepinedgeis0.3mm.
TABLE1.PINFUNCTIONDESCRIPTIONS
FlexPCBpad
(Topto
Bottom,see
Figure2)
Mic
Pin Description
1 LR Left/rightchannelselect
2 WS WordselectforI
2
Sinterface
3 SD SerialdigitaloutputsignalforI
2
Sinterface
4 SCK SerialclockforI
2
Sinterface
5 VDD Power,1.62to3.63V
6 GND Ground
EVALUATIONBOARDCIRCUIT
Figure1showtheschematicsoftheevaluationboard,and
Figure2showstheboardlayout.Seethemicrophonedata
sheetsforcompletedescriptionsandspecifications.
Figure1.EV_ICS‐43434‐FXEvaluationBoardSchematic
Figure2.EV_ICS‐43434‐FXEvaluationBoardLayout(TopView)
Figure3.EvaluationBoardDimensionsinMillimeters
VDD
U1
ICS‐43434
SCK
LR
WS
SD
SCK
C1
0.1µF
L/R
WS
SD
4
2
1
5
3
6
GND
GND
VDD