AN‐000012
DifferentialAnalogOutputMEMSMicrophoneFlexEvaluationBoardUserGuide
InvenSensereservestherighttochangethedetail
specificationsasmayberequiredtopermit
improvementsinthedesignofitsproducts.
InvenSenseInc.
1745TechnologyDrive,SanJose,CA95110U.S.A
+1(408)988–7339
www.invensense.com
DocumentNumber:AN‐000012
Revision:1.2
Rev.Date:06/15/2016
GENERALDESCRIPTION
ThisuserguideappliestothefollowingMEMSmicrophone
evaluationboards:
EV_ICS‐40618‐FX
EV_ICS‐40619‐FX
EV_ICS‐40720‐FX
Thisisasimpleevaluationboardthatallowquickevaluationof
the performance of differential output analog MEMS
microphones.Thesmallsizeandlowprofileoftheflexible
PCB
enablesdirectplacementofthemicrophoneintoaprototype
oranexistingdesignforaninsituevaluation.Theevaluation
board consists of a bottom port microphone soldered to a
flexiblePCBwithcolor‐codedwiresattached.Theonlyother
componentontheboardisa0.1μFsupply
bypasscapacitor.
Table1describesthefunctionsofthefourconnectionwires.
Table2 explainsthefunctional differences betweenthetwo
microphonesandevaluationboards.
TABLE1.PINFUNCTIONDESCRIPTIONS
WIRE
COLOR
MICROPHONE
PIN DESCRIPTION
Red VDD PowerSupply.1.5Vdcto3.6V
dc.
White OUTPUT+ AnalogOutputSignal+
Blue OUTPUT− AnalogOutputSignal−
Black GND Ground.
TABLE2.ICS‐40720SPECIFICATIONS
Microphone Sensitiv ity
Maximum
Output
Voltage
Output
Impedance
Mic Port
Location
ICS‐40618−38dBV 1.0Vrms 750Ω Bottom
ICS‐40619−38dBV 1.0Vrms 750Ω Top
ICS‐40720−32dBV 0.63V
rms
700Ω Bottom
EVALUATIONBOARDCIRCUIT
Figure 1 shows the schematic of the evaluation boards, and
Figures 2‐4 show the flex board layouts. See the respective
microphone data sheets for complete descriptions and
specificationsofthemicrophones.
Figure1.EvaluationBoardSchematic
Figure2.EV_ICS‐40618‐FXBoardLayout(TopView)
Figure3.EV_ICS‐40619‐FXBoardLayout(TopView)
Figure4.EV_ICS‐40720‐FXBoardLayout(TopView)
Figure5.DimensionsinMillimeters(WiresNotIncluded)
V
DD
0.1µF
OUTPUT‐
GND
MICROPHONE
OUTPUT+
12.00
3.60