82563EB/82564EB Gigabit Platform LAN
Connect
Networking Silicon
Datasheet
Product Features
■ IEEE 802.3ab c omplia nt
—Robust operation over the installed base of
Category-5 (Cat-5) twisted pair cabling
■ PICMG 3.1 compliant
—Robust operation in backplane over
Ethernet applications.
■ Support for cable line length s greater than
100 m (spec); 123 m physical
—Robust en d t o end co nn ect io ns over
various cable lengths
■ Full du ple x at 10 , 100 , or 1000 Mb/s a nd ha lf
duplex at 10 or 100 Mb / s.
■ IEEE 802.3ab Auto-negotiation with Next
Page support
—Automatic link configuration including
speed, duplex, and flow control
■ 10/100 downshift
—Automatic link speed adjustment with
poor quality cable
■ Automatic MDI cro ssover
—Helps to correct for infrastructure issues
■ Advanced Cable Diagnostics
—Improved end-user troubleshooting
■ Kumeran interface
—Low pin count, high speed interface to the
Intel® 631xESB/632xESB I/O Controller
Hub
—Allows PHY placement proximity to I/O
back pane l.
■ 7 LED outputs per port (4 configurable plus 3
dedicated)
—Link and Activity indications (10, 100,
1000 Mb/s) on each port
■ Clo c k supplied to the 631xESB/632xESB
—Cost optimized design
■ Full chip power down
—Support for lowest power state
■ 100 pin TQFP Package
—Smaller footprint and lower power
dissipation compared to multi-chip MAC
and PHY solutions
■ Operating temperatu re: 0 °C to 60° C
(maximum) – he at sink or forced airflow not
required
—Simple thermal design
■ Power Consumpti on: < 1. 0 Wat ts per port
(silicon power)
—Minimize impact of incorporating dual
Gigabit instead of Fast Ethernet
■ Leaded and lead-free
a
100-pin TQFL with an
Exposed-Pad*. Devices that are lead-f ree are
marked with a circled “e3” and have a
product code: HYXXXXX
a.This devi ce is le a d-f re e . Tha t is, lead has not be e n intentionally added, but lead may still e xis t a s an impurity at <1000 ppm.
The Material Decl aration Data Sheet, which includes l ead impurity levels and t he concentrati on of other Res triction on Hazar d-
ous Substances (RoHS) -banned materials, is available at:
ftp://download.intel.com/design/packtech/material_content_IC_Pack
In addition, this device has been tes ted and co nforms to the same parametr ic s pe cifica tions a s previous versions of the devi ce.
For more in formation re ga rd ing lead-free pro ducts from In te l C orporation, contact your Inte l Fie ld Sales representa tive.
316534-004
Revision 2.9
