Intel
£
Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
The Intel
®
Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power applications.
The C3 device incorporates low-voltage capability (3 V read, program, and erase) with high-
speed, low-power operation. Flexible block locking allows any block to be independently locked
or unlocked. Add to this the Intel
®
Flash Data Integrator (FDI) software and you have a cost-
effective, flexible, monolithic code plus data storage solution. Intel
®
Advanced+ Boot Block Flash
Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA
packages. Additional information on this product family can be obtained by accessing the Intel
®
Flash website: http://www.intel.com/design/flash.
■ Flexible SmartVoltage Technology
—2.7 V– 3.6 V Read/Program/Erase
—12 V for Fast Production Programming
■ 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option
—Reduces Overall System Power
■ High Performance
—2.7 V– 3.6 V: 70 ns Max Access Time
■ Optimized Architecture for Code Plus
Data Storage
—Eight 4 Kword Blocks, Top or Bottom
Parameter Boot
—Up to One Hundred-Twenty-Seven 32
Kword Blocks
—Fast Program Suspend Capability
—Fast Erase Suspend Capability
■ Flexible Block Locking
—Lock/Unlock Any Block
—Full Protection on Power-Up
—WP# Pin for Hardware Block Protection
■ Low Power Consumption
—9 mA Typical Read
—7 A Typical Standby with Automatic
Power Savings Feature (APS)
■ Extended Temperature Operation
—–40 °C to +85 °C
■ 128-bit Protection Register
—64 bit Unique Device Identifier
—64 bit User Programmable OTP Cells
■ Extended Cycling Capability
—Minimum 100,000 Block Erase Cycles
■ Software
—Intel
®
Flash Data Integrator (FDI)
—Supports Top or Bottom Boot Storage,
Streaming Data (e.g., voice)
—Intel Basic Command Set
—Common Flash Interface (CFI)
■ Standard Surface Mount Packaging
—48-Ball µBGA*/VFBGA
—64-Ball Easy BGA Packages
—48-Lead TSOP Package
■ ETOX™ VIII (0.13 µm) Flash
Technology
—16, 32 Mbit
■ ETOX™ VII (0.18 µm) Flash Technology
—16, 32, 64 Mbit
■ ETOX™ VI (0.25 µm) Flash Technology
—8, 16 and 32 Mbit
Order Number: 290645-017
October 2003
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
