E
PRODUCT PREVIEW
Ma
1998 Order Number: 290645-001
Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
2.7 V or 1.65 V I/O Option Reduces
Overall System Power
12 V for Fast Production
Programming
High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
Optimized Architecture for Code Plus
Data Storage
Eight 8-Kbyte Blocks,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks
Fast Program Suspend Capability
Fast Erase Suspend Capability
Flexible Block Locking
Lock/Unlock Any Block
Full Protection on Power-Up
WP# Pin for Hardware Block
Protection
V
PP
= GND Option
V
CC
Lockout Voltage
Low Power Consumption
9 mA Typical Read Power
10 µA Typical Standby Power with
Automatic Power Savings Feature
Extended Temperature Operation
–40 °C to +85 °C
Easy-12 V
Faster Production Programming
No Additional System Logic
128-bit Protection Register
64-bit Unique Device Identifier
64-bit User Programmable OTP
Cells
Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles
Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., voice)
Automated Word/Byte Program and
Block Erase
Command User Interface
Status Registers
SRAM-Compatible Write Interface
Cross-Compatible Command Support
Intel Basic Command Set
Common Flash Interface
x 16 for High Performance
48-Ball µBGA* Package
48-Lead TSOP Package
x 8 I/O for Space Savings
48-Ball µBGA* Package
40-Lead TSOP Package
0.25 µ ETOX™ VI Flash Technology
The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a
feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage
capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking
allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data
Integrator (FDI) software and you have a cost-ef fecti ve, fl exible, m onol i thic c ode pl us data storage s ol ution on
the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,
and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing
Intel’s WWW page: http://www.intel.com/design/flcomp.
3 VOLT ADVANCED+ BOOT BLOCK
8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F008C3, 28F016C3, 28F032C3
28F800C3, 28F160C3, 28F320C3
