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28F008B3

28F008B3首页预览图
型号: 28F008B3
PDF文件:
  • 28F008B3 PDF文件
  • 28F008B3 PDF在线浏览
功能描述: SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
PDF文件大小: 304.24 Kbytes
PDF页数: 共48页
制造商: INTEL[Intel Corporation]
制造商LOGO: INTEL[Intel Corporation] LOGO
制造商网址: http://www.intel.com
捡单宝28F008B3
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品牌
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  • 深圳市安富世纪电子有限公司

    7

    0755-8257321018124040553杨丹妮0755-82573210深圳市福田区中航路都会轩240611012658

  • 28F008B3
  • MT 
  • TSSOP 
  • 19+ 
  • 2000 
  • 是终端可以免费供样,支持BOM配单!原装正品 

  • 集好芯城

    16

    0755-8328588218188616606陈妍深圳市福田区深南中路3023号汉国中心55楼11010804

  • 28F008B3
  • MT 
  • TSSOP 
  • 最新批? 
  • 5704 
  • 原厂原装现货现卖 

  • 深圳创芯佳业科技有限公司

    8

    0755-8326777413925253466蔡先生,谢小姐深圳市福田区华强电子世界23C120室深圳创芯佳业科技有限公司主营:NXP、TI、ADI、ON、ST、Maxim、microchip等进口原装正品集成IC!支持订货,支持含税,承接Bom表配单!实单必成,欢迎电话/微信/QQ咨询:蔡先生/谢小姐11016192

  • 28F008B3-10
  • INTEL 
  • TSOP 
  •  
  • 4 
  • 只做原装正品,支持含税 

PDF页面索引
120%
E
PRELIMINARY
Jul
y
1998 Order Number: 290580-005
Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
12 V V
PP
Fast Production
Programming
2.7 V or 1.65 V I/O Option
Reduces Overall System Power
High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
Optimized Block Sizes
Eight 8-KB Blocks for Data,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks for
Code
Block Locking
V
CC
-Level Control through WP#
Low Power Consumption
10 mA Typical Read Current
Absolute Hardware-Protection
V
PP
= GND Option
V
CC
Lockout Voltage
Extended Temperature Operation
–40 °C to +85 °C
Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., Voice)
Automated Program and Block Erase
Status Registers
Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles Guaranteed
Automatic Power Savings Feature
Typical I
CCS
after Bus Inactivity
Standard Surface Mount Packaging
48-Ball µBGA* Package
48-Lead TSOP Package
40-Lead TSOP Package
Footprint Upgradeable
Upgrade Path for 4-, 8-, 16-, and 32-
Mbit Densities
ETOX™ VI (0.25 µ) Flash Technology
The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and
interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single
device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,
monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-
lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be
obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.
SMART 3 ADVANCED BOOT BLOCK
4-, 8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3, 28F320B3
28F008B3, 28F016B3, 28F032B3
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