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1P1G66QDCKRQ1

1P1G66QDCKRQ1首页预览图
型号: 1P1G66QDCKRQ1
PDF文件:
  • 1P1G66QDCKRQ1 PDF文件
  • 1P1G66QDCKRQ1 PDF在线浏览
功能描述: SINGLE BILATERAL ANALOG SWITCH
PDF文件大小: 905.2 Kbytes
PDF页数: 共19页
制造商: TI[Texas Instruments]
制造商LOGO: TI[Texas Instruments] LOGO
制造商网址: http://www.ti.com
捡单宝1P1G66QDCKRQ1
PDF页面索引
120%

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SCES499D − OC TOBER 2003 − REVISED JANUARY 2008
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Qualified for Automotive Applications
D 1.65-V to 5.5-V V
CC
Operation
D Inputs Accept Voltages to 5.5 V
D High On-Off Output Voltage Ratio
D High Degree of Linearity
D High Speed, Typically 0.5 ns
(V
CC
= 3 V, C
L
= 50 pF)
D Low On-State Resistance, Typically 5.5
(V
CC
= 4.5 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
description/ordering information
This single analog switch is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing f o r
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
§
−40°C to 125°C
SOT (SOT-23) − DBV Reel of 3000 1P1G66QDBVRQ1 C66_
−40
°
C to 125
°
C
SOT (SOT-70) − DCK Reel of 3000 1P1G66QDCKRQ1 C6_
For the most current package and ordering information, see the Package Option Addendum at the end of this document,
or see the TI web site at http://www.ti.com.
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
§
The actual top-side marking has one additional character that designates the wafer fab/assembly site.
FUNCTION TABLE
CONTROL
INPUT
(C)
SWITCH
L OFF
H ON
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its published specifications.
DBV or DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
A
B
GND
V
CC
C
Copyright 2008, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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