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1211201

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型号: 1211201
PDF文件:
  • 1211201 PDF文件
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功能描述: Version 1.0 of the SiM3U1xx
PDF文件大小: 203.72 Kbytes
PDF页数: 共4页
制造商: SILABS[Silicon Laboratories]
制造商LOGO: SILABS[Silicon Laboratories] LOGO
制造商网址: http://www.silabs.com
捡单宝1211201
PDF页面索引
120%
Process Change Notice #1211201
____________________________________________________________________________________________________
W7206F1 Process Change Notice Form rev AH
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1
User Registration
Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document
updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content
available only to registered users. http://www.silabs.com/profile
PCN Date: 11/20/2012
Effective Date: 2/26/2013
Title: SiM3U1xx and SiM3C1xx Datasheet v1.0 Availablity
Originator: Shahram Tadayon
Phone: 512 428 1698
Dept: Marketing
Customer Contact: Kathy Haggar
Phone: 512 532 5261
Dept: Sales
PCN Type:
Datasheet
Foundry
Product Revision
Assembly
Discontinuance
Test
Last Order Date: Not Applicable
PCN Details
Description of Change:
Version 1.0 of the SiM3U1xx and SiM3C1xx datasheets and Reference Manual are now available. This
update applies to the SiM3U1xx family of 32-bit USB MCUs and SiM3C1xx family of 32-bit broad
based MCUs, including all parts beginning with the SiM3U1 and SiM3C1 base part number.
See Appendix for complete description of the changes.
The SiM3U1xx and SiM3C1xx 1.0 datasheets are available at www.silabs.com
This change also includes an improvement in Moisture Sensitivity Level (MSL) from level 3 to level 2
for the 80 TQFP, 64 TQFP, 64 QFN, and 40 QFN package options.
Reason for Change:
The SiM3U1xx and SiM3C1xx v1.0 datasheets includes minor updates, additions and corrections to
the specifications and text descriptions, as noted in the Appendix. The MSL change includes an
improved manufacturing exposure time. These changes were made based on completion of device
characterization and release to full production.
Impact on Form, Fit, Function, Quality, Reliability:
There is no impact on form, fit, quality and reliability. Functional changes were made to the
DEVICEID0 registers to enhance device identification information.
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