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106406-0000

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型号: 106406-0000
PDF文件:
  • 106406-0000 PDF文件
  • 106406-0000 PDF在线浏览
功能描述: FlexPlaneTM Optical Circuitry
PDF文件大小: 2947.72 Kbytes
PDF页数: 共4页
制造商: MOLEX[Molex Electronics Ltd.]
制造商LOGO: MOLEX[Molex Electronics Ltd.] LOGO
制造商网址: http://www.molex.com
捡单宝106406-0000
PDF页面索引
120%
FEATURES AND SPECIFICATIONS
FlexPlane
TM
Optical Circuitry
106401 Standard
106404 Flame-Retardant
106406 3D Compact
Substrates
High-density FlexPlane Optical Circuitry provides high-density optical routing on
PCBs or backplanes
Molex’s FlexPlane optical flex circuitry provides one
of the highest density and versatile interconnect
systems on the market today. For high fiber-count
interconnects in backplanes and cross-connect systems,
Molex’s FlexPlane provides a manageable means
of fiber routing from card-to-card or shelf-to-shelf.
Designed for versatility, the standard FlexPlane (Series
106401) provides high-density routing on a flexible,
flame-resistant substrate. Additional options are
now available including flame-retardant assemblies
and 3D versions.
As the industry requirements for flammability have
become more stringent, Molex developed a custom
flame-retardant FlexPlane assembly. The flame-
retardant FlexPlane assembly (Series 106404)
meets the UL Optical Branching Device Flammability
requirements.
The 3D FlexPlane (Series 106406) provides almost a
50% substrate size reduction compared to the standard
FlexPlane. This is critical, as board space and air flow
continue to become a stringent part of OEM design
requirements. Traditional FlexPlane flex circuits are
routed on a single substrate. The 3D FlexPlane routes
the fiber on multiple stacked substrates to achieve a
compact routing area.
A variety of interconnects, including Blind Mate MTP
(BMTP™), High Density Blind Mate MT (HBMT™),
Blind Mate LC (BLC™) and Blind Mate SC (BSC™) can
be used to connect the optical flex circuits to individual
cards in a shelf. Available in any routing scheme, fiber
can be routed point-to-point, in a shuffle, or in a logical
pattern to meet specific requirements. Direct or fusion-
spliced terminations are available.
Packaging alternatives include standard bare flexible
substrate, sandwiched in FR-4 or custom laminating.
Each FlexPlane circuit can be fully tested down to
the per port insertion loss and return loss. For more
information on Molex’s FlexPlane offering, visit:
www.molex.com/fiber/flexplane.html.
Standard FlexPlane (Series 106401) Flame-Retardant FlexPlane (Series 106404)
3D FlexPlane (Series 106406)
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