1
Non resettable fuses
SMD-SPT
www.schurter.com/pg01_2
Fuses
Surface Mount Fuse, 5 x 20 mm, Time-Lag T, H, 250 VAC, Au plating
IEC 60127-2 · 250 VAC · 300 VDC · Time-Lag T
Description
- Directly solderable on printed circuit boards
- IEC Standard Fuse
- H = High Breaking Capacity
Standards
- IEC 60127-2/5
- UL 248-14
- CSA C22.2 no. 248.14
Approvals
- VDE Certificate Number: 40010881
- UL File Number: E41599
Applications
- Primary Protection on SMD PCB
References
Packaging Details
Weblinks
pdf, html, General Product Information, Approvals, RoHS, CHINA-RoHS,
e-Shop, SCHURTER-Stock-Check, Distributor-Stock-Check
Technical Data
Rated Voltage 250 VAC, 300 VDC
Rated Current 1 - 16 A
Breaking Capacity 500 A - 1500 A
Characteristic Time-Lag T
Mounting PCB,SMT
Admissible Ambient Air Temp. -55 °C to 125 °C
Climatic Category 55/125/21 acc. to IEC 60068-1
Material: Housing Ceramic
Material: Terminals Gold-Plated Copper Alloy
Unit Weight 1 g
Storage Conditions 0 °C to 60 °C, max. 70% r.h.
Product Marking , Current, Voltage, Characteristic,
Breaking Capacity
Soldering Methods Reflow
Solderability 245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
Resistance to Soldering Heat 260 °C / 10 sec acc. to IEC 60068-2-58,
Test Td
Resistance to Vibration acc. to IEC 60068-2-6, test Fc
Moisture Resistance Test MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
Terminal Strength MIL-STD-202, Method 211A
Deflection of board 1 mm for 1 minute
Thermal Shock MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
Case Resistance acc. to EIA/IS-722, Test 4.7
>100 M
Ω (between leeds and body)
Resistance to Solvents MIL-STD-202, Method 215A
Dimensions
20 mm
10
ø 5.2
20
+0.1
-0.2
±0.5
±0.2
Soldering pads